EMC compounds in a circuit board
Application

Epoxy resin molding compounds (EMC)

for use in electronics, medical technology and the automotive industry

Epoxy molding compounds have been known for their good electrical and mechanical properties as well as their excellent chemical and aging resistance for a long time. The first descriptions and patents originate from the 1930s.

The epoxy resin molding compound consists of a polymer matrix (epoxy resins, hardeners and accelerator catalysts) which is mixed with fillers, reinforcement materials, pigments, separating agents, etc. and molded as granulates/chips.

Typical areas of application

Glass diodes example for epoxy resin molding compounds
Electronic components consisting of epoxy resin molding compounds
Epoxy resin technology is an appropriate method for producing automotive components
Medical endoscopes example for overmolding epoxy resin molding compounds
Endoscopy example for the use of epoxy resin molding compounds

Epoxy resin molding compounds react in a polyaddition reaction, i.e. no side products arise when molding. Therefore, independent of the type of molded part, identical final properties are achieved, independent of the wall thickness.

If the reaction in the mold is completed, no further changes to the mechanical, electrical or thermal properties take place. Re-hardening is not necessary and reaction-caused post-molding is virtually non-existent. This is also one of the reasons for the outstanding long-term stability of epoxy molding compounds.

Therefore, they meet demanding requirements profiles for diverse applications in electronics, medical technology and the automotive industry. With the ongoing progressing miniaturization of electrical components and their simultaneously increasing performance, the requirements of an insulating coating system which protects against environmental influence are further increased.

Thus, for example, they must withstand numerous sterilisation processes for medical technology without damage and demonstrate a high degree of resistance against X-rays.

Further insights into our options for the plastics industry and medical technology

Benefits

BUSS compounding systems offer the following specific benefits for epoxy resin preparation

The BUSS Co-Kneader guarantees intense distributive mixing, as the superimposition of rotation and axial movement of the mixing and kneading screw causes flow separations and a large number of shearing surfaces, thereby generating cross-channel mixing.

The BUSS compounding machine technology allows high filler loadings by splitting to 2-3 feed positions, use of feed-in processes such as side feeders, gravimetric dosing units, back venting and excellent conveying efficiency. The moderate Co-Kneader shear rates allow effortless handling of the high viscosities arising with high filler loadings.

Uniform shear rates allow controlled mixing in the compounding machine at lower temperatures while imparting only the required shear energy for the task at hand. The narrow shear rate distribution compared to alternative systems ensures uniform shear histories for every individual particle. This results in high-quality processing with reduced energy input.

The BUSS Co-Kneader allows precise temperature control due to controlled energy input and uniform, moderate shear rates as well as their temperature monitoring by thermocouples, which are mounted in drilled kneading pins surrounded by polymer at relevant positions along the process section.

Novel hard metal alloys provide superb performance for highly-abrasive applications such as EMC. The life cycle of elements and kneading pins could be increased by a factor of 5 compared with traditional wear-resistant materials.

Compounding requirements

of epoxy resin molding compounds

In addition to the gentle integration of the high content of additives, the central requirement in the preparation step for epoxy resin molding compounds is the adherence to the temperature limit below the cross-linking temperature. This succeeds with the BUSS Co-Kneader due to its working principle, during which a relaxation sequence follows each gentle shear cycle in an excellent manner.

Optimal process temperatures can be monitored at any time due to exact measurement of the product temperature via drilled kneading pins. This data can also be used as a proof of quality assurance. Customized material solutions are responsible for above-average service life in the process room.

The economical throughputs and all the advantages of the continuous production means such as extremely constant and traceable product quality, a high degree of utilization and availability of the machines round off the excellent suitability of the BUSS Co-Kneader technology. Augmented with the widely supported BUSS process expertise, the BUSS Co-Kneader is first choice for the continuous compounding of epoxy molding compounds.

Typical plant layout

Typisches Anlagenlayout für die Herstellung von EP-Masse

Become acquainted with our BUSS Co-Kneader series

BUSS Co-Kneaders

worldwide

Our patented Co-Kneaders are used worldwide nowadays, supporting our customers in the production of plastics. Using the BUSS compounding systems, our customers can master all the demanding requirements for epoxy resin compounding.

World map with an overview of the BUSS Co-Kneaders used for EMC compounding

Number of Co-Kneaders used for EMC compounding

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COMPEO series

We present: COMPEO, the state-of-the-art compounder that offers more versatility in its application, higher flexibility in process engineering, and increased added value in compound manufacturing.

Epoxy Moulding Compounds Fact Sheet

In addition to the gentle incorporation of high filler loadings, the key requirement in the production of epoxy molding compounds is to maintain the absolute temperature limit below the cross-linking temperature.

Plant and System Solutions

Custom compounding systems from BUSS: tailor-made concepts, integration of all components, precise assembly, and smooth commissioning. Comprehensive expertise results in sustainable compounding solutions for a wide range of material applications.